| Session 20:
Metrology and Instrumentation (Display Manufacturing) |
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Wednesday, May 23 / 10:40 am - 12:00 pm / Room 102 |
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Chair:
Thomas G. Fiske, Rockwell Collins Display Systems
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Co-Chair:
Frank F. Rochow, LMT Lichtmesstechnik GmbH
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20.1: |
Invited Paper:
Metrology and
Robustness of Bright-Room Contrast Measurements
Edward F. Kelley, NIST, Boulder, CO, U.S.A. |
|
20.2: |
An Improved Method for Measuring
Display Motion Artifacts
Michael Wilson, Westar Display Technologies, Inc., Saint Charles,
MO, U.S.A. |
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20.3: |
Quantitative Analysis of Image
Sticking in LCDs
Seung-Chul Park, LG.Philips LCD, Kyungbuk, Korea
|
| Session 31:
Display Manufacturing: Plasma and FEDs (Display
Manufacturing/FED/Emissive Displays)
|
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Wednesday, May 23 / 5:10 - 6:30 pm / Room 102 |
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Chair:
Elliott Schlam, Elliott Schlam Associates
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Co-Chair:
Harm Tolner, Tolner Technology
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31.1: |
Distinguished
Paper: FED Spacer Fabrication with Nozzle
Dispense
Manabu Yabe, Dainippon Screen Mfg. Co., Ltd., Kyoto, Japan
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31.2: |
Distinguished
Student Paper: Ulta-Slim Barrier Ribs for PDPs by
X-Ray-Lithography Process
Sueng-Min Ryu, KAIST, Daejeon, Korea
|
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31.3: |
Rapid Laser Patterning of ITO on Glass
for the Manufacture of Next-Generation PDPs
Matt Henry, Powerlase Ltd., Crawley, U.K.
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31.4: |
Transparent Conductive Mesh Film Using
Silver Halide Photographic Technologies
Yoshihiro Fujita, FUJIFILM Corp., Kanagawa, Japan
|
| Session 48:
Display Manufacturing: Substrates and Coatings (Display
Manufacturing) |
|
Thursday, May 24 / 2:00 - 3:20 pm / Room 102 |
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Chair:
Josef C. Lapp, Corning Incorporated
|
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Co-Chair:
Peter A. Smith, Honeywell, Inc.
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48.1: |
Behavior of LCD Panels During Bending
Suresh Gulati, Corning Incorporated, Corning, NY, U.S.A. |
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48.2: |
The Chemical Durability of EAGLE XG in LCD
Dry-Etch Processes
Robert Bellman, Corning Incorporated, Corning, NY, U.S.A. |
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48.3: |
The Development of Precision Patterning for LCD
Color Filters
Brian Eyre, Dupont Imaging Technologies, Wilmington, DE, U.S.A. |
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48.4: |
Flexible LCD Films by Plasma Alignment Method
Kang-Hung Liu, EOL/ITRI, Chutung, Hsinchu Taiwan
|
| Session 54:
Display Manufacturing: Ink-Jet Printing (Display
Manufacturing) |
|
Thursday, May 24 /
3:40 - 5:00 pm / Room 102 |
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Chair:
Elliott Schlam, Elliott Schlam Associates
|
|
Co-Chair:
Lauren F. Palmateer, Qualcomm MEMS Technologies
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54.1: |
LED Packaging by Ink-Jet Microdeposition of
High-Viscosity Resin and Phosphor Dispersion
Isao Amemiya, Toshiba Corp., Kawasaki, Japan |
|
54.2: |
Vertical-Alignment-Type Small Display Panels
with Alignment Layer Formed by Ink-Jet-Printing Technology
Kuang-Hua Liu, ChungHwa
Picture Tubes, Ltd., Taoyuan, Taiwan |
|
54.3: |
Drop-Landing-Accuracy Improvements in
Ink-Jet-Printed OLED Displays
Chris Phillips, CDT, Godmanchester, U.K. |
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54.4: |
Ink-Jet Printing of Single-Wall Carbon Nanotubes
with Transparent Conductive Film
Chang Soo Han, KIMM, Daejeon, Korea
|
| Session 60:
Display Manufacturing: Deposition Methods (Display
Manufacturing) |
|
Thursday, May 25 /
9:00 - 10:20 am / Room 102 |
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Chair:
Greg Gibson, FAS Technologies, LLC
|
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Co-Chair:
Toshiaki Arai, Sony Corp.
|
|
60.1: |
Invited Paper: Low-Temperature Thermal
CVD Process for Thin-Film Encapsulation of Organic Light-Emitting
Devices
Chieh Chen, International Display Systems, Fremont, CA, U.S.A. |
|
60.2: |
Research on Next-Generation Manufacturing
Methods of PDPs via Lift-Off Process
Eiji Morinaga, Osaka University, Osaka, Japan |
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60.3: |
Advanced Application of Direct Laser Process on
SnO2 Thin Films for FPDs
Reo Usui, Osaka University, Osaka, Japan |
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60.4: |
Single-Layer Metal Interconnection for TFT-LCDs
Using Direct Contact with ITO and a-Si by Al-Ni System
Toshihiro Kugimiya, Kobelco Kaken, Inc., Japan
|
| Session 65:
Display Manufacturing: Packaging (Display Manufacturing) |
|
Friday, May 25 /
10:40 am - 11:40 am / Room 102 |
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Chair:
Lauren F. Palmateer, Qualcomm MEMS Technologies
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Co-Chair:
Jun Hyung Souk, Samsung Electronics Co., Ltd.
|
|
65.1: |
Invited Paper: An Overview of Display
Interconnect Assembly Trends: Technologies & Markets
Peter Opdahl, Ito Corp., Tokyo, Japan |
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65.2: |
MOVED TO 51.5 |
|
65.3: |
Intrinsic Patterning Principle on Array Repair
Using Laser Metal Transfer
Eisaku Kojima, OMRON Corp., Kyoto, Japan |
|
65.4: |
Stress Corrosion Cracking of Patterned ITO
Electrodes for Flexible Displays
Karpagavalli Ramji, West Virginia University, Morgantown, WV,
U.S.A.
|
| Poster Session |
Tuesday, May 22 / 4:00 - 7:00 pm / Exhibit Hall A
|
|
Display Manufacturing |
|
P.50: |
The Impact of Thermal Stress, Mechanical Stress, and the
Environment on Dimensional Reproducibility of Polyester Film
During Flexible Electronics Processing
Bill MacDonald, Dupont Teijin Films, Wilton Centre, Middlesborough,
U.K. |
|
P.51: |
Novel Positive-Type Photosensitive Insulating Materials by
Organic / Inorganic Hybrid Technologies as a Passivation Layer on
TFT-LCDs
Yasunari Kusaka, Sekisui Chemical Co., Ltd., Osaka, Japan |
|
P.52: |
Wet Corrosion of Sputtered Mo Thin Film on Glass Substrates
in Various Acid Solutions
Jong Hyun Seo, Hankuk Aviation University, Kyunggi-do, Korea |
|
P.53: |
New TPS Function for Identifying Nano-Scale Organic Film
Phase in Large-Sized AMOLED Deposition Processes Using
Belt-Source Evaporation Techniques
Chang-Hun Hwang, OLEDON Technology, Kyunggi-do, Korea |
|
P.54: |
Effect of the Residual Stress on the Mechanical Properties
of PDP Glass Substrates
Jonghee Hwang, Korea Institute of Ceramic Engineering &
Technology, Seoul, Korea |
|
P.55: |
Cell Filling of Flexible LCDs Using One-Line Filling and
Tilted Roller Pressing
Wen Tuan Wu, Southern Taiwan University of Technology, Tainan,
Taiwan |
|
P.56: |
Aligning Liquid Crystals Using Self-Assembled Monolayers
Boris Kobrin, Applied Microstructures, Inc., San Jose, CA, U.S.A.
|
|
P.210: |
Ta-Doped SnO2 Thin
Films for FPDs
Yu Mihara, Osaka University, Osaka, Japan
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