EXHIBITORS' FORUM PRESENTATION SCHEDULE

TUESDAY, MAY 24, EXHIBIT HALL D

Session 1: Display Materials (10:30 am - 12:00 pm)

1.1: Fujifilm's Products and Technologies for FPD
Y. Suga, Fuji Photo Film Co., Ltd., Japan
Booth 733
(10:30)
1.2: Advanced LC Materials for TV Applications
W. W. Becker and K. Tarumi, Merck KGaA, Germany
Booth 1712
(10:45)
1.3: Inherently Dissipative "Bayon" Plate for FPD Glass Carrier
T. Abe, Kureha Chemical Industry Co Ltd., Japan
Booth 427
(11:00)
1.4: eGraf®- Cooling Current and Next Generation Displays
R. A. Reynolds, GrafTech International Ltd., Parma, OH
Booth 809
(11:15)
1.5: Contrast Enhancement of LCOS-based Projection Displays
C. Iaconis, JDS Uniphase, Santa Rosa, CA
Booth 1719
(11:30)
1.6: Display Top Glass
J. Bannicke, BERLINER GLAS KGaA, Germany
Booth 622
(11:45)
LUNCH (12:00-2:00)

Session 2: Display Manufacturing Processes (2:00-3:00 pm)

2.1: Mechanical Singulation of Microsheet Glass
E. K. Linden, TLC International, Phoenix, Arizona
Booth 302
(2:00)
2.2: Innovative Digital Manufacturing Solutions with Ink Jet
L. T. Creagh, Spectra, Inc
Booth 2307
(2:15)
2.3: Moving to a Lower-cost Assembly Model for Heat Seal
Connector (HSC) and Anisotropic Conductive Film (ACF)
Applications

P. J. Opdahl, Ito Corporation, Japan
Booth 1904
(2:30)
2.4: High Density, Large Area Micro-optics Patterned by Laser
M. Scaggs, Exitech, Inc., Sunrise, FL
Booth 2236
(2:45)

WEDNESDAY, MAY 25, EXHIBIT HALL D

Session 3: Innovative Display Technologies and Applications (9:00-10:30 am)

3.1: TDEL - The Affordable Alternative
D. Carkner, iFire Technology Corp. Toronto, Canada
Booth 2003
(9:00)
3.2: Reflective & Bistable Cholesteric Displays
K. Bellamy, Kent Displays, Inc., Kent, OH
Booth 1919
(9:15)
3.3: Demonstrator of a Laser Projection Device With a 2D Micro Scanning Mirror
M. Scholles, Fraunhofer IPMS, Germany
Booth 1014
(9:30)
3.4: THE XO-FRAIM™ BONDED LCD 
R. C. Robinder, General Digital Corporation, Optical Bonding Laboratories, South Windsor, CT
Booth 1309
(9:45)
3.5: Affordable Custom AMLCD Solutions for Rugged Applications
J. Niemczyk, American Panel Corporation, Alpharetta, GA
Booth 2037
(10:00)
3.6: Display Management in the Enterprise 
S. Anderson, Portrait Displays, Inc., Pleasanton, CA
Booth 2323
(10:15)

Session 4: Display Interfaces and Electronics (10:30-11:45 am)

4.1: Tactile Touchscreens - Touchscreens that Touch Back
M. Levin, Immersion Corporation, San Jose, CA
Booth 533
(10:30)
4.2: The Introduction of ZYPOS®, the Capacitive Touch Sensor Technology of the Future
A. Morrison, Zytronic, UK
Booths 1323
(10:45)
4.3: Low Reflective Analog Resisitive Touch Panels
J. W. Stetson, Gunze USA, Austin, TX
Booth 2138
(11:00)
4.4: Increasing Display Performance with PenTile™ Technology
J. M. Pollack, Clairvoyante, Inc., Cupertino, CA
Booth 1412
(11:15)
4.5: HDMI Interface Port Protection
J. C. Dunnihoo, CMD PC / Consumer Applications, Austin, TX
Booth 405
(11:30)
LUNCH (11:45-2:00)

Session 5: OLEDs (3:30-4:45 pm)

5.1: New Stretching Glass Chuck Technology For Large-Size OLED Deposition Equipment
C. C. Hwang, Doosan DND, Korea
Booth 207
(3:30)
5.2: OLED materials from Hodogaya Chemical
T. Obara, Hodogaya Chemical, Japan
Booth 408
(3:45)
5.3: OLED Deposition System: ANS
BK Chun, ANS, Inc., Korea
Booth 915
(3:30)
5.4: Leading the way to a brighter future: Advanced Test System Architecture for HB LED and OLED panels
C. Chuang, Chroma ATE, Inc., Irvine, CA
Booth 1304
(3:45)
5.5: Innovative Encapsulation Glass for OLED and Top Emitting OLED
J. Bannicke, BERLINER GLAS KGaA, Germany
Booth 622
(4:00)
THURSDAY, MAY 26, EXHIBIT HALL D
Session 6: Display Metrology (9:00 am-12:00 pm)
6.1: Achieving Faster and More Complete Flat Panel Output Measurements
J. Serra, Radiant Imaging, Inc., Duvall, WA
Booth 803
(9:00)
6.2: The PR-524 and PR-525 Hand Held Light Meters
M. Klein, Photo Research, Inc., Chatsworth, CA
Booth 500
(9:15)
6.3: A Wide Variety of Application for Inspection of Flat Panel Displays by Using Vis/NIR Spectroscopy
K. Kitagishi, Otsuka Electronics Co., Japan
Booth 304
(9:30)
6.4: Accelerated UV/Weathering Testing - The Right Choice
S. Novak, Q-Panel Lab Products, Cleveland, OH
Booth 528
(9:45)
6.5: Novel application of Optical Interferometry for Panel Displays and Printed electronic Circuits
J. Horwitz, Veeco Instruments, Tucson, AZ
Booth 1125
(10:00)
BREAK (10:15-10:45)
6.6: Imaging Colorimetry: Instrument Systems Introduces the
Lumicam 4000 with 10 Megapixels of Spatial Resolution

M. Godejohann, Instruments Systems GmbH, Germany
Booth 505
(10:45)
6.7: High Accuracy 2D Colorimeters: General Trends and Applications to ELDIM Systems
J.N. Curt, ELDIM, France
Booth 1501
(11:00)
6.8: High-Resolution Inspection of Display Glass and Film
T. A. Potts, Dark Field Technologies, Inc., Shelton, CT
Booth 2130
(11:15)
6.9: Preparing for the High LCM demand: In-Line Test Solutions for LCM Manufacturing
K. Wang, Chroma ATE, Inc., Irvine, CA
Booth 1304
(11:30)
6.10: Sheet-to-Sheet and Roll-to-Roll Inspection Systems
J. Koenig, Dr. Schenk of America LLC, Woodbury, MN
Booth 922
(11:45)